Reduction of carbonized particles

ABSTRACT

The above described deficiencies and drawbacks are overcome by the process for making poly(arylene ether)-polyamide compositions which comprise about 10 weight percent (wt %) to about 90 wt % poly(arylene ether), about 90 wt % to about 10 wt % polyamide, about 0.01 wt % to about 10 wt % compatibility modifier, and optionally other additives known in the art. The process comprises several components which can be employed singly or in combination, namely: utilizing resins and additives that are substantially free of gaseous oxygen (air-free; e.g. less than about 1.0 vol % oxygen preferred, and less than about 0.5 vol % oxygen especially preferred, and less than about 0.05 vol % especially preferred); melting and compounding under an atmosphere which is substantially air-free; adding up to 20 wt % of polyamide to the poly(arylene ether) before compounding; when employing an extruder with an atmospheric vent, operating with the atmospheric vent open; and performing the injection molding under an inert atmosphere.

TECHNICAL FIELD

The present invention relates to a method for making poly(aryleneether)-polyamide compositions.

BACKGROUND OF THE INVENTION

Poly(arylene ether) resins are characterized by a unique combination ofchemical, physical and electrical properties over a broad temperaturerange. This combination of properties renders poly(arylene ether)ssuitable for a wide range of applications. However, the usefulness ofpoly(arylene ether) resins is limited as a consequence of their poorprocessability, impact resistance and chemical resistance. Poly(aryleneether)-polyamide compositions, as disclosed by Finholt (U.S. Pat. No.3,379,792), overcame processability issues. However, the advantages ofthe Finholt invention are limited by the fact that when theconcentration of the polyamide exceeds 20 weight percent (wt %),appreciable losses in other physical properties result. Specifically,there is no, or at best poor, compatibility between the poly(aryleneether) and the polyamide such that phase separation of the resin occurson molding or the molded article is inferior in mechanical properties.

Compatibilized poly(arylene ether)-polyamide compositions have beenproduced utilizing a variety of base resins and compatibilizing systems.These thermoplastic products offer a wide range of beneficial propertieswhich take advantage of the strengths of the basic resins whileimproving upon the weaknesses of each. Among the most useful propertiesof compatibilized poly(arylene ether)-polyamide compositions areexcellent heat resistance, chemical resistance, impact strength,hydrolytic stability and dimensional stability. Such compatibilizedpoly(arylene ether)-polyamide compositions have found great utility inexterior automotive applications such as body panels. Examples ofcompatibilized poly(arylene ether)-polyamide compositions can be foundin U.S. Pat. No. 4,315,086.

Polyfunctional compatibility modifiers can facilitate formation of acopolymer of the poly(arylene ether) and polyamide components. Such areaction has been readily shown to take place under the time,temperature and shear conditions of typical thermoplastic extrusionprocesses. Copolymer produced in this fashion may serve as a meltsurfactant which stabilizes the morphology of the resinous components ofthe system. Compatibility may also be achieved by improved interfacialadhesion of the resinous components.

Methods for making compatibilized poly(arylene ether)-polyamidecompositions are well known in the prior art. U.S. Pat. No. 5,000,897 toChambers, discloses a process for making a poly(arylene ether) andpolyamide composition which is comprised of several steps. Poly(aryleneether) resin is blended with a first polyamide component together with apolyfunctional compatibility modifier, an optional rubber impactmodifier and typical stabilizers, if desired. This mixture is fed to thefeedthroat of an extruder which begins compounding the ingredients toprovide an intermediate poly(arylene ether)-polyamide product. After thefirst compounding step, the second polyamide component is added to theintermediate poly(arylene ether)-polyamide composition, and additionalcompounding takes place. The compatibilized poly(aryleneether)-polyamide final product, which, in this instance, is theextrudate of the compounding process, is dried and pelletized byconventional means to provide thermoplastic resin products.

Poly(arylene ether)-polyamide compositions are usually amenable to manydifferent types of processing operations, such as extrusion, compressionmolding and injection molding. However under certain conditions, finalproducts resulting from the operations exhibit some imperfections. Theseimperfections fall into two classes, solid particles visible on thesurface and flow disturbance artifacts such as pinholes, “V” shapeimperfections, and sinkmarks visible as dents in the surface. Theseimperfections, which often become magnified when painted, are caused bycarbonized particles (also known as pits) which are formed duringprocessing operations such as extrusion and injection molding. Articlesformed from poly(arylene ether)-polyamide compositions with surfaceimperfections are typically rejected, thereby increasing themanufacturing cost.

There is a continuing need to make poly(arylene ether)-polyamidecompositions and articles from said composition with a decreased numberof carbonized particles and a concurrently decreased number of surfaceimperfections.

SUMMARY OF THE INVENTION

A process to produce a poly(arylene ether)-polyamide composition,comprising creating and maintaining a substantially inert atmosphere inan extruder; combining poly(arylene ether) resin and an optionalcompatibility modifier in the extruder to form a mixture; compoundingthe mixture; and adding polyamide to the mixture and further compoundingto form the poly(arylene ether)-polyamide composition.

Alternatively the process for producing a poly(arylene ether)-polyamidecomposition comprises creating and maintaining a substantially inertatmosphere in an extruder; combining poly(arylene ether) resin, anoptional compatibility modifier, and up to about 20 wt % polyamide resinin the extruder to form a mixture; compounding the mixture; and addingadditional polyamide resin to the compounded mixture and furthercompounding to form the poly(arylene ether)-polyamide composition.

Also part of the invention is a process for forming an article from apoly(arylene ether)-polyamide composition, comprising creating andmaintaining an inert atmosphere in a molding device; adding thepoly(arylene ether)-polyamide composition to the molding device; meltingthe poly(arylene ether)-polyamide composition; forcing the moltencomposition into a mold; and cooling the mold and releasing theresulting article.

BRIEF DESCRIPTION OF THE DRAWINGS

The FIGURE is meant to illustrate, not limit, the present invention.

The FIGURE is a cube plot of the number of pits per plaque for theDesign of Experiments set up described in Example 11 and Table 5, basedupon the use of the atmospheric vent, a nitrogen purge, and/or theintroduction of polyamide upstream.

DETAILED DESCRIPTION OF THE INVENTION

The above described deficiencies and drawbacks are overcome by a processfor making poly(arylene ether)-polyamide compositions which utilizeabout 10 weight percent (wt %) to about 90 wt % poly(arylene ether),about 90 wt % to about 10 wt % polyamide, optionally about 0.01 wt % toabout 15 wt % compatibility modifier, and other additives known in theart, based on the total weight of the composition. The process comprisesseveral components which can be employed singly or in combination,namely: utilizing resins and additives that are substantially free ofgaseous oxygen (air-free, e.g. less than about 1.0 volume percent (vol%) oxygen preferred, and less than about 0.5 vol % oxygen morepreferred, and less than about 0.05 vol % especially preferred); meltingand compounding under an atmosphere which is air-free; adding up toabout 20 wt % of polyamide to the poly(arylene ether) before compounding(“split-feeding”); operating with the atmospheric vent open whenemploying an extruder with an atmospheric vent; and performing injectionmolding under an inert atmosphere.

The process comprises: flushing the poly(arylene ether) resin with aninert gas to obtain a resin which is air-free or alternately, employinga poly(arylene ether) resin which is already air-free; adding thepoly(arylene ether), optionally a compatibility modifier, and/or otheradditives and up to about 20 wt % of polyamide based on the total weightof the composition to an extruder under an inert atmosphere; melting andcompounding the above components; adding the remaining polyamide; andfurther compounding. The resulting polymer can be pelletized orotherwise processed by any method known in the art, with underwaterpelletization preferred. Preferably the whole process, from productionof raw materials to compounding, extruding, pelletization and molding isperformed under a substantially inert atmosphere.

Poly(arylene ether)

All conventional poly(arylene ether)s can be employed with the presentinvention. The term includes poly(arylene ether) and copolymers, graftcopolymers, and ionomers thereof; block copolymers of alkenyl aromaticcompounds, vinyl aromatic compounds and poly(arylene ether); andcombinations comprising at least one of the foregoing. Poly(aryleneether)s per se, are known polymers comprising a plurality of structuralunits of the formula (I):

wherein for each structural unit, each Q¹ is independently hydrogen,halogen, primary or secondary lower alkyl (e.g., alkyl containing up to7 carbon atoms), phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, orhalohydrocarbonoxy wherein at least two carbon atoms separate thehalogen and oxygen atoms; and each Q² is independently hydrogen,halogen, primary or secondary lower alkyl, phenyl, haloalkyl,hydrocarbonoxy or halohydrocarbonoxy as defined for Q¹. Preferably, eachQ¹ is alkyl or phenyl, especially C₁₋₄ alkyl, and each Q² is hydrogen.

Both homopolymer and copolymer poly(arylene ether) are included. Thepreferred homopolymers are those containing 2,6-dimethylphenylene etherunits. Suitable copolymers include random copolymers containing, forexample, such units in combination with 2,3,6-trimethyl-1,4-phenyleneether units or copolymers derived from copolymerization of2,6-dimethylphenol with 2,3,6-trimethylphenol. Also included arepoly(arylene ether) containing moieties prepared by grafting vinylmonomers or polymers such as polystyrenes, as well as coupledpoly(arylene ether) in which coupling agents such as low molecularweight polycarbonates, quinones, heterocycles and formals undergoreaction in known manner with the hydroxy groups of two poly(aryleneether) chains to produce a higher molecular weight polymer. Thepoly(arylene ether)s further include combinations comprising at leastone of the above.

It will be apparent to those skilled in the art from the foregoing thatthe poly(arylene ether) contemplated for use in the present inventioninclude all those presently known, irrespective of variations instructural units or ancillary chemical features. Examples ofpoly(arylene ether)s and methods for their production are disclosed inU.S. Pat Nos. 3,306,874; 3,306,875; 3,257,357; 3,257,358; 3,337,501 and3,787,361.

The amount of poly(arylene ether) used in the composition can be about10 to about 90 wt %, with about 20 to about 80 wt % preferred, and about30 to about 60 wt % especially preferred.

Polyamide

The polyamide resins include a generic family of resins known as nylons,characterized by the presence of an amide group (—C(O)NH—). Nylon-6 andnylon-6,6 are the generally preferred polyamides and are available froma variety of commercial sources. Other polyamides, however, such asnylon-4, nylon-4,6, nylon-12, nylon-6,10, nylon 6,9, and others such asthe amorphous nylons, may be useful for particular poly(aryleneether)-polyamide applications. Mixtures of various polyamides, as wellas various polyamide copolymers, are also useful, with nylon-6,6,especially preferred.

The polyamides can be obtained by a number of well known processes suchas those described in U.S. Pat. Nos. 2,071,250; 2,071,251; 2,130,523;2,130,948; 2,241,322; 2,312,966; and 2,512,606. Nylon-6, for example, isa polymerization product of caprolactam. Nylon-6,6 is a condensationproduct of adipic acid and 1,6-diaminohexane. Likewise, nylon 4,6 is acondensation product between adipic acid and 1,4-diaminobutane. Besidesadipic acid, other useful diacids for the preparation of nylons includeazelaic acid, sebacic acid, dodecane diacid, as well as terephthalic andisophthalic acids, and the like. Other useful diamines include m-xylyenediamine, di-(4-aminophenyl)methane, di-(4-aminocyclohexyl)methane;2,2-di-(4-aminophenyl)propane, 2,2-di-(4-aminocyclohexyl)propane, amongothers. Copolymers of caprolactam with diacids and diamines are alsouseful.

It is also to be understood that the use of the term “polyamides” hereinand in the appended claims is intended to include the toughened or supertough polyamides. Super tough polyamides, or super tough nylons, as theyare more commonly known, such as those available commercially, e.g. fromE.I. duPont under the trade name Zytel ST, or those prepared inaccordance with U.S. Pat. No. 4,174,358 to Epstein; U.S. Pat No.4,474,927 to Novak; U.S. Pat. No. 4,346,194 to Roura; and U.S. Pat. No.4,251,644 to Jeffrion, among others and combinations comprising at leastone of the foregoing, can be employed.

Generally, these super tough nylons are prepared by blending one or morepolyamides with one or more polymeric or copolymeric elastomerictoughening agents. Suitable toughening agents are disclosed in theabove-identified U.S. Patents as well as in U.S. Pat. No. 3,884,882 toCaywood, Jr., U.S. Pat. No. 4,147,740 to Swiger, and Gallucci et al.,“Preparation and Reactions of Epoxy-Modified Polyethylene”, J. Appl.Poly. Sci., V 27, pp. 425-437 (1982) (which are herein incorporated byreference). Typically, these elastomeric polymers and copolymers may bestraight chain or branched as well as graft polymers and copolymers,including core-shell graft copolymers, and are characterized as havingincorporated therein either by copolymerization or by grafting on thepreformed polymer, a monomer having functional and/or active or highlypolar groupings capable of interacting with or adhering to the polyamidematrix so as to enhance the toughness of the polyamide polymer.

The amount of polyamide utilized in the composition can be about 10 toabout 90 wt %, with about 20 to about 80 wt % preferred, and about 30 toabout 60 wt % especially preferred.

Compatibility Modifier

The two fold purpose for using compatibility modifiers is to improve thephysical properties of the poly(arylene ether)-polyamide resin, as wellas to enable the use of a greater proportion of the polyamide component.However, a compatibility modifier may not be necessary when all of aportion of the poly(arylene ether) is an ionomer. When used herein, theexpression “compatibility modifier” refers to those polyfunctionalcompounds which interact with the poly(arylene ether), the polyamide, orboth. This interaction may be chemical (e.g. grafting) or physical (e.g.affecting the surface characteristics of the dispersed phases). Ineither instance the resulting poly(arylene ether)-polyamide compositionappears to exhibit improved compatibility, particularly as evidenced byenhanced impact strength, mold knit line strength and/or elongation. Asused herein, the expression “compatibilized poly(aryleneether)-polyamide resin” refers to those compositions which have beenphysically or chemically compatibilized with a modifier as discussedabove, as well as those compositions which are physically compatiblewithout such agents, as taught in U.S. Pat. No. 3,379,792.

Examples of the various compatibilizing modifiers that may be employedinclude: a) liquid diene polymers, b) epoxy compounds, c) oxidizedpolyolefin wax, d) quinones, e) organosilane compounds, and f)polyfunctional compounds. Functionalized poly(arylene ether), asdescribed, are obtained by reacting one or more of the previouslymentioned compatibility modifiers with poly(arylene ether).

Liquid diene polymers (a) include homopolymers of a conjugated dienewith at least one monomer selected from other conjugated dienes; vinylmonomer, e.g. styrene and alphamethyl styrene; olefins, e.g. ethylene,propylene, butene-1, isobutylene, hexene-1, octene-1 and dodecene-1, andmixtures thereof, having a number average molecular weight of about 150to about 10,000, preferably about 150 to about 5,000. These homopolymersand copolymers can be produced by the methods described in, for example,U.S. Pat. Nos. 4,054,612; 3,876,721 and 3,428,699 and include, amongothers, polybutadiene, polyisoprene, poly(1,3-pentadiene),poly(butadiene-isoprene), poly(styrene-butadiene), polychloroprene,poly(butadiene-alpha methylstyrene), poly(butadiene-styrene-isoprene),poly(butylene-butadiene), and combinations comprising at least one ofthe foregoing.

Epoxy compounds (b) include: (1) epoxy resins produced by condensingpolyhydric phenols (e.g. bisphenol-A, tetrabromobisphenol-A, resorcinoland hydroquinone) and epichlorohydrin; (2) epoxy resins produced bycondensing polyhydric alcohols (e.g., ethylene glycol, propylene glycol,butylene glycol, polyethylene glycol, polypropylene glycol,pentaerythritol and trimethylolethane, and the like) andepichlorohydrin; (3) glycidyletherified products of monohydric alcoholsand monohydric phenols including phenyl glycidylether, butyl glycidylether and cresyl glycidylether; (4) glycidyl derivates of aminocompounds, for example, the diglycidyl derivate of aniline; (5)epoxidized products of higher olefinic or cycloalkene, or naturalunsaturated oils (e.g. soybean) as well as of the foregoing liquid dienepolymers; and combinations comprising at least one of the foregoing.

Oxidized polyolefin waxes (c) are well known and an illustrativedescription thereof and processes for the production of the same arefound in U.S. Pat. Nos. 3,822,227 and 3,756,999. Generally, these areprepared by an oxidation or suspension oxidation of polyolefin.

Quinone compounds (d) are characterized as having in the molecule of theunsubstituted derivative at least one six-membered carbon ring; at leasttwo carbonyl groups in the ring structure, both of which may be in thesame or, if more than one ring, different rings, provided that theyoccupy positions corresponding to the 1,2- or 1,4-orientation of themonocyclic quinone; and at least two carbon-carbon double bonds in thering structure, the carbon-carbon double bounds and carbonylcarbon-oxygen double bonds in the ring structure, the carbon-carbondouble bonds and carbonyl carbon-oxygen double bonds being conjugatedwith respect to each other. Where more than one ring is present in theunsubstituted quinone, the rings may be fused, non-fused, or both:non-fused rings may be bound by a direct carbon-carbon double bond or bya hydrocarbon radical having conjugated unsaturation such as —C═C—C═C—.

Substituted quinones may also be used. The degree of substitution, wheresubstitution is desired, may be from one to the maximum number ofreplaceable hydrogen atoms. Exemplary of the various substituents thatmay be present on the unsubstituted quinone structures include halogen(e.g. chlorine, bromine, fluorine, etc.); hydrocarbon radicals includingbranched and unbranched, saturated and unsaturated alkyl, aryl, alkylaryl and cycloalkyl radicals and halogenated derivatives thereof; andsimilar hydrocarbons having hetero atoms therein, particularly oxygen,sulfur, or phosphorous and wherein the same connects the radical to thequinone ring (e.g. oxygen link).

Examples of suitable quinones include 1,2- and 1,4-benzoquinone;2,6-diphenyl quinone; tetramethyldiquinone; 2,2′- and4,4′-diphenoquinone; 1,2-,1,4- and 2,6-naphthoquinone;tetrachlorobenzoquinone; 2-chloro-1,4 -benzoquinone; and 2,6-dimethylbenzoquinone.

Organosilane compounds (e) suitable as compatibility modifiers arecharacterized as having in the molecule (1) at least one silicon atombonded to a carbon through an oxygen link and (2) at least onecarbon-carbon double bond or carbon-carbon triple bond and/or afunctional group selected from an amine group or a mercapto groupprovided that the functional group is not directly bonded to the siliconatom. In such compounds, the C—O—Si component is generally present as analkoxyl or acetoxy group bonded directly to the silicon atom, whereinthe alkoxy or acetoxy group generally has less than 15 carbon atoms andmay also contain hetero atoms. Additionally, there may also be more thanone silicon atom in the compound, such multiple silicon atoms, ifpresent, being linked through an oxygen link (e.g. siloxanes), a siliconbond, or a bifunctional organic radical (e.g. methylene or phenylenegroups), or the like.

Examples of suitable organosilane compounds include: gamma aminopropyltriethoxy silane, 2-(3-cyclohexanyl)ethyl trimethoxy silane;1,3-divinyl tetraethoxy silane, vinyl tris-(2-methoxyethoxy)silane,5-bicycloheptenyl triethoxy silane, and gamma mercapto propyl trimethoxysilane.

Polyfunctional compounds (f) which may be employed as a compatibilitymodifier are of three types. The first type of polyfunctional compoundsare those having in the molecule both (1) a carbon-carbon double bond ora carbon-carbon triple bond and (2) at least one carboxylic acid,anhydride, amide, ester, imide, amino, epoxy, orthoester, or hydroxygroup. Examples of such polyfunctional compounds include maleic acid;maleic anhydride; fumaric acid; glycidyl acrylate, itaconic acid;aconitic acid; maleimide; maleic hydrazide; reaction products resultingfrom a diamine and maleic anhydride, maleic acid, fumaric acid, etc.;dichloro maleic anhydride; maleic acid amide; unsaturated dicarboxylicacids (e.g. acrylic acid, butenoic acid, methacrylic acid,t-ethylacrylic acid, pentenoic acid); decenoic acids, undecenoic acids,dodecenoic acids, linoleic acid, etc.); esters, acid amides oranhydrides of the foregoing unsaturated carboxylic acids; unsaturatedalcohols (e.g. alkyl alcohol, crotyl alcohol, methyl vinyl carbinol,4-pentene-1-ol, 1,4-hexadiene-3-ol, 3-butene-1,4-diol,2,5-dimethyl-3-hexene-2,5-diol and alcohols of the formulaC_(n)H_(2n−5)OH, C_(n)H_(2n−7)OH and C_(n)H_(2n−9)OH, wherein n is apositive integer up to 30); unsaturated amines resulting from replacingfrom replacing the hydroxyl group(s) of the above unsaturated alcoholswith NH₂ groups; and functionalized diene polymers and copolymers; andthe like. Maleic anhydride and fumaric acid are preferred.

The second group of polyfunctional compatibility modifiers suitable foruse herein are characterized as having both (1) a group represented bythe formula (OR) wherein R is hydrogen or an alkyl, aryl, acyl orcarbonyl dioxy group and (2) at least two groups each of which may bethe same or different selected from carboxylic acid, acid halide,anhydride, acid halide anhydride, ester, orthoester, amide, imido,amino, and various salts thereof. Typical of this group of compatibilitymodifiers are the aliphatic polycarboxylic acids, acid esters and acidamides represented by the formula:

(R^(I)O)_(m)R^(V)(COOR^(II))_(n)(CONR^(III)R^(IV))_(s)

wherein R^(V) is a linear or branched chain, saturated aliphatichydrocarbon of from 2 to 20, preferably 2 to 10, carbon atoms; R^(I) ishydrogen or an alkyl, aryl, acyl or carbonyl dioxy group of 1 to 10,preferably 1 to 6, most preferably 1 to 4, carbon atoms, preferablyhydrogen; each R^(II) is independently hydrogen or an alkyl or arylgroup from 1 to 20 carbon atoms, preferably from 1 to 10 carbon atoms;each R^(III) and R^(IV) are independently hydrogen or an alkyl or arylgroup of from 1 to 10, preferably from 1 to 6, most preferably 1 to 4,carbon atoms; m is equal to 1 and (n+s) is greater than or equal to 2,preferably equal to 2 or 3, and n and s are each greater than or equalto zero and wherein (OR^(I)) is alpha or beta to a carbonyl group and atleast two carbonyl groups are separated by 2 to 6 carbon atoms.Obviously, R^(I), R^(II), R^(III) and R^(IV) cannot be aryl when therespective substituent has less than 6 carbon atoms.

Suitable polycarboxylic acids include, for example, citric acid, malicacid, agaricic acid, and the like; including the various commercialforms thereof, such as for example, the anhydrous and hydrated acids. Ofthese, citric acid is another of the preferred compatibility modifiers.Illustrative of esters useful herein include, for example, acetylcitrate and mono- and/or distearyl citrates and the like. Suitableamides useful herein include, for example, N,N′-diethyl citric acidamide; N-phenyl citric acid amide; N-dodecyl citric acid amide;N,N′-didodecyl citric acid amide and N-dodecyl malic acid. Especiallypreferred derivates are the salts thereof, including the salts withamines and/preferably, the alkali and alkaline metal salts. Exemplary ofsuitable salts include calcium malate, calcium citrate, potassiummalate, and potassium citrate.

The third group of polyfunctional compatibility modifiers suitable foruse herein are characterized as having in the molecule both (1) an acidhalide group, most preferably an acid chloride group and (2) at leastone carboxylic acid, anhydride, ester, epoxy, orthoester, or amidegroup, preferably a carboxylic acid or anhydride group. Examples ofcompatibility modifiers within this group include trimellitic anhydrideacid chloride, chloroformyl succinic anhydride, chloro formyl succinicacid, chloroformyl glutaric anhydride, chloroformyl glutaric acid,chloroacetyl succinic anhydride, chloroacetylsuccinic acid, trimelliticacid chloride, and chloroacetyl glutaric acid. Among these, trimelliticanhydride acid chloride is preferred. Furthermore, it is especiallypreferred that compatibility modifiers of this group be prereacted withat least a portion of the poly(arylene ether) whereby the compatibilitymodifier is a poly(arylene ether)-functionalized compound.

The foregoing compatibility modifiers are more fully described in U.S.Pat. Nos. 4,315,086; 4,600,741; 4,642,358; 4,826,933; 4,927,894;4,980,424; 5,041,504; and 5,115,042.

The foregoing compatibility modifiers may be used alone or in variouscombinations comprising at least one of the above mentionedcompatibility modifiers. Furthermore, they may be added directly to themelt blend or pre-reacted with either or both the poly(arylene ether)and polyamide, as well as with other resinous materials employed in thepreparation of the compositions. With many of the foregoingcompatibility modifiers, particularly the polyfunctional compounds, evengreater improvement in compatibility is found where at least a portionof the compatibility modifier is pre-reacted, either in the melt or in asolution of a suitable solvent, with all or a part of the poly(aryleneether). It is believed that such pre-reacting may cause thecompatibility modifier to react with the polymer and, consequently,functionalize the poly(arylene ether) as noted above. For example, thepoly(arylene ether) may be pre-reacted with maleic anhydride to form ananhydride functionalized poly(arylene ether) which has improvedcompatibility with the polyamide compared to a non-functionalizedpoly(arylene ether).

Where the compatibility modifier is employed in the preparation of thecompositions, the initial amount used will be dependent upon thespecific compatibility modifier chosen and the specific polymeric systemto which it is added. The amount of compatibility modifier used shouldbe sufficient to prevent phase separation of the poly(arylene ether) andpolyamide. The typical amounts are up to about 10 wt %, with about 0.05to about 5.0 wt % preferred, and about 0.1 to about 3 wt % especiallypreferred.

It is possible to use in the composition any other knowncompatibilization system. Other systems have been described for examplein U.S. Pat. No. 4,866,114.

Additives

The composition can also include effective amounts of at least oneadditive selected from impact modifiers, release agents, stabilizers,organic and/or inorganic fillers, conductive agents, UV stabilizers,anti-oxidants, flame retardants, drip retardants, dyes, pigments,colorants, stabilizers, small particle mineral (such as clay, mica, talcand the like), antistatic agents, plasticizers, lubricants, and mixturescomprising at least one of the above mentioned additives. Theseadditives are known in the art, as are their effective levels andmethods of incorporation. Effective amounts of the additives varywidely, but they are usually present in an amount up to about 50 wt % ormore, based on the weight of the entire composition. Especiallypreferred additives include hindered phenols, thio compounds and amidesderived from various fatty acids. The preferred amounts of theseadditives generally ranges up to about 3 wt %.

Especially useful are additives for conductivity: carbon black, carbonfibrils, carbon fibers, carbon nanofibers, carbon nanotubes, carbonparticles, and combinations comprising at least one of the abovementioned additives.

The composition comprising the above mentioned components can beprepared in numerous fashions. As described earlier, the processcomprises several components, which can be employed singly or incombination. The general procedure comprises: introducing thepoly(arylene ether) resin, preferably air free, optionally up to 20 wt %polyamide resin, with up to about 15 wt % preferred, and about 5 toabout 10 wt % especially preferred, and optionally a compatibilitymodifier and other additives, to an extruder or similar mixing device,preferably with an inert atmosphere, to form a mixture. The mixture ismelted and compounded, preferably under an inert atmosphere, prior toadding the remaining polyamide. When employing an extruder with anatmospheric vent, as described below, it is preferable to operate withthe atmospheric vent open. The remaining polyamide is added, preferablyunder an inert atmosphere, and the resulting mixture is then furthermelted, compounded, and finally palletized preferably by underwaterpelletization, or otherwise finally processed by any method known in theart.

Air free poly(arylene ether) can be obtained by flushing thepoly(arylene ether) particles with an inert gas a sufficient number oftimes such that the resin is substantially free of gaseous oxygen. Inertgases include all gases which are unreactive towards poly(aryleneether), polyamide or other components of the composition. Possible inertgases include hydrogen, helium, neon, argon, nitrogen, carbon dioxide,and the like, and mixtures comprising at least one of the abovementioned gases, with nitrogen preferred. Poly(arylene ether) particlesare porous and as a result gaseous oxygen can infiltrate the interior ofthe particles. Flushing the particles removes this oxygen which cancause oxidation of the poly(arylene ether) and therefore the formationof carbon particles. As stated earlier, carbon particles cause surfaceimperfections.

The extruder preferably has an inert atmosphere obtained by flushing theextruder with an inert gas so as to substantially remove the gaseousoxygen contained within. The inert atmosphere is preferably maintainedduring addition of the above mentioned components by a continuing flowof inert gas. The flow rate can be up to or exceeding about 20 liters ofinert gas per kilogram of poly(arylene ether) (1 N₂/kg PPE), with about1 liter inert gas/kg poly(arylene ether) to about 15 liters inert gas/kgpoly(arylene ether) preferred, and about 6 liters inert gas/kgpoly(arylene ether) to about 13 liters inert gas/kg poly(arylene ether)especially preferred. The flow rates of the various components, which isdetermined by the screw design and geometry of the extruder, can bedetermined by an artisan without undue experimentation.

Possible extruders include all conventional devices capable ofintimately mixing the components and maintaining the desiredenvironment, for example single screw, twin screw or other multiplescrew extruders, as well as other mixing devices such as kneaders andthe like capable of effectively mixing the composition. Due to mixingrequirements and environmental controls, an extruder having at least twofeed ports with an atmospheric vent there between is preferred, with anextruder having at least two feedports, an atmospheric vent and at leastone vacuum vent especially preferred.

In the extruder, the resin(s), additives and optional modifiers areintimately mixed at, a temperature sufficient to melt and compound thepoly(arylene ether), e.g. typically about 250° C. to about 320° C., andpreferably about 275° C. to about 305° C. The remaining polyamide isthen added and the mixture is further mixed so as to obtain the desiredproduct. The resulting polymer is then put through a die, roller, orother final processor, and formed into pellets, sheets, a web or thelike, by any method known in the art, with underwater pelletizationpreferred.

In order to further reduce the presence of oxygen, the various initialcomponents, e.g. the poly(arylene ether) resin, the portion of thepolyamide resin, compatibility modifier, and optional impact modifierand other additives, can be premixed. This mixture can then be flushedwith an inert gas so as to obtain a mixture which is substantially freeof gaseous oxygen. The flushed mixture is then added to the extruder orother appropriate mixing device, with an inert atmosphere under the flowof an inert gas as described above. From the extruder the mixture ispelletized, formed into a sheet, or otherwise processed as isconventional.

The processed mixture can be utilized to form various articles, such asautomotive parts. One technique of forming these parts comprisesinjection molding; a method commonly utilized to form articles frompolymer resins. This process involves adding the mixture to a feedhopper, heating the mixture to a temperature sufficient to melt themixture and forming the mixture into the desired shape by forcing itinto a mold. Again, to further prevent the formation of pits, it ispreferable to use inert gas(es) to create and maintain an inertatmosphere over the mixture during this processing. The preferred inertatmosphere during article formation comprise the use of inert gas asdescribed above, with the use of nitrogen and hydrogen more preferred.The nitrogen-hydrogen mixture can be about 90 volume percent (vol %) toabout 99 vol % nitrogen, with about 93 vol % to about 98 vol %preferred. Other conventional further processing techniques can also beemployed.

All patents cited are incorporated herein by reference. The invention isfurther illustrated by the following non-limiting examples.

EXAMPLES

In the following examples a WP-28 Werner and Pfleiderer twin screwextruder was used with a main feeder disposed at the front-end of theextruder and a second feeder located approximately halfway down theextruder with an atmospheric vent located between the two feeders and avacuum vent located between the downstream feeder and the die of theextruder. Nitrogen was introduced via a pipe at the bottom of the mainfeeder to flush the extruder and maintain the nitrogen atmosphere duringthe addition of ingredients. The nitrogen flow rate was monitored with aflow meter. The extruder was operated using the parameters defined inTable 1. Feeder % is the percentage of the total throughput of theextruder. The poly(arylene ether)-polyamide composition comprised about50 wt % poly(arylene ether) and additives and about 50 wt % polyamide.Molding was done on a KM350, forming DIN A5 plaques for molding withinert atmosphere while for the standard molding conditions 4 cm×4 cmplaques were used. The 4 cm×4 cm plaques were formed by injectionmolding with a low injection speed and the plaque was not completelyfilled. Low injection speed is defined as the minimal speed of injectionrequired to obtain a good quality plaque. The plaques were notcompletely filled in order to improve the visibility of the defect.Incomplete filling makes the carbonized particles surface at the flowend of the plaque.

TABLE 1 Temperature settings Z1 215° C. Z2 280° C. Z3 300° C. Z4 290° C.Z5 290° C. Z6 290° C. Z7 290° C. Z8 290° C. die 310° C. Machine SettingsScrew Speed (rpm) 300 Throughput  10 (kg/h) Feeder 1 (%)  52.3 Feeder 2(%)  47.7 Vacuum vent Full Atmospheric vent Open Read out values Tmelt323° C. Torque (%)  52

The plaques were evaluated for pits by two methods. The first methodinvolved a visual inspection and quantification of the number of surfacedefects. The second method was a filtration test. The plaque wasdissolved in a mixture of chloroform and trifluoroacetic acid. Thesolution was then filtered and the amount of insoluble was evaluatedusing automatic image analysis software. The method of evaluation isalso known as the insolubles test.

Examples 1-3

Examples 1-3 use the same procedure with varying nitrogen flow rates. Nopolyamide was introduced through the first feeder of the extruder. 3.67kilograms (kg) of poly(arylene ether) and additives, 0.8 kg of styreneethylene propylene, 0.7 kg of styrene ethylene butylene styrene, and0.65 kg of citric Acid were introduced to the main feeder with nitrogenflow. 4.8 kg of polyamide were introduced at the second feeder andprocessing continued. The resulting composition was then pelletized andformed into plaques. The plaques were evaluated for pits and insolublesas shown in Table 2. The nitrogen flow rates for Examples 1-3 were 1.2liter per kg (l/kg), 5.5 /kg, and 11.5 l/kg, respectively. The controlmaterial was made without nitrogen flow.

TABLE 2 Example Control 1 2 3 Number of pits per  20   5   4.8    2.3plaque Number of insolubles 3294 1151 1066   637

Examples 4-5

3.67 kg of poly(arylene ether), 0.65 kg of citric acid, 0.8 kg ofstyrene ethylene propylene, and 0.7 kg of styrene ethylene butylenestyrene were introduced to the main feeder which had been flushed withnitrogen and had a continuing nitrogen flow of 1.2 liters per minute(l/min). 4.8 kg of polyamide was introduced at the second feeder andprocessing continued. The resulting composition was then pelletized andformed into 4 cm×4 cm plaques. The plaques were evaluated for pits andinsolubles as shown in Table 3. In Example 4 the poly(arylene ether) wasnot flushed. In Example 5 the poly(arylene ether) was flushed five timeswith nitrogen prior to adding to the extruder.

TABLE 3 Examples Control 4 5 Number of pits per  20   4.2    3.2 plaqueNumber of insolubles 3294 1151   500

Examples 6-10

3.67 kg of poly(arylene ether) and additives, 0.8 kg of styrene ethylenepropylene, 0.7 kg of styrene ethylene butylene styrene, and 0.65 kg ofcitric acid was introduced to the main feeder. Amounts of polyamideadded at the main feeder varied by experiment (see Table 4 for details)with the total amount of polyamide added kept constant at 4.8 kg. Theremaining polyamide was introduced at the second feeder and processingcontinued. The resulting compositions were then pelletized and formedinto plaques. The plaques were evaluated for pits and insolubles.Results are shown in Table 4.

TABLE 4 Examples Control 6 7 8 9 10 PA introduced at main   0   1   5 10   15   25 feeder (wt %) Number of pits per plaque  20  11   5   4.2 6.5 22 Number of insolubles per 3294 1480 1364 1072   — — plaque

Example 11

The effect of the position of the atmospheric vent (open or closed) wasexamined in a Design Of Experiment Setup. Conventionally all compoundingis performed with the atmospheric vent closed in contrast to thepreceding examples in which the atmospheric vent was open. The Design ofExperiment Setup is a tool to evaluate and compare experimental resultsof a process when different parameters are varied. The Design ofExperiment Setup looked at the influence of polyamide ratio (mainfeeder/second feeder), position of the atmospheric vent, and nitrogenatmosphere. Assignments of the key parameters are shown in Table 5, withthe Figure graphically depicting the experiments as defined in theDesign of Experiments. FIG. 1 clearly shows the beneficial effects ofsplit feeding the polyamide, compounding under nitrogen and operatingwith the atmospheric vent open. It is also clear from the Figure that acombination of parameters results in a greater reduction of in thenumber of pits and insolubles.

TABLE 5 Key Parameters Polyamide split-feeding 0%-5%-10% −1/0/1 NitrogenNo-Yes −1/1 Atmospheric vent Open-Closed (−10 mbar)* −1/1 *: same as inmanufacturing

Examples 12-13

A molding trial was done on a KM350 with a compatibilized poly(aryleneether)-polyamide composition molding DIN A5 plaques using the conditionsshown in Table 6.

TABLE 6 Screw diameter 60 millimeters Z1 temperature 270° C. Z2temperature 280° C. Z3 temperature 290° C. Z4 temperature 295° C. Melttemperature 310° C. Injection pressure 55 bar/hydr Holding pressure 32bar Holding pressure 8 seconds Back pressure 6 bar

The feed hopper of the molding machine was flushed with an inert gas. Aslight over pressure was maintained to ensure an oxygen level below 1vol % in feed hopper (oxygen level of about 0.02 vol % or less typicallyachieved).

In the control no inert gas was used; in Example 12 the inert gas wasnitrogen; and in Example 13 the inert gas was a mixture of nitrogen andhydrogen gas (97 vol % N₂/3 vol % H₂). The plaques were evaluated forpits and insolubles. Results are shown in Table 7.

TABLE 7 Number of insolubles/60 Examples Inert Gas grams ReductionControl 1685 — 11 100% N₂ 1190 29% 12 97 vol % N₂/3  910 46% vol % H₂

A significant reduction of number of insolubles was found by purging thefeed hopper with inert gas, and particularly with purging with a mixtureof nitrogen and hydrogen. As can be seen from Table 7, the product hasless than about 1,500 insolubles per 60 grams (isol./60 g), with lessthan about 1,200 isol./60 g typical and about 1,000 isol./60 g or lesspreferred. This represents an improvement of conventional composition.

The present invention reduces pits by namely compounding under an inertatmosphere, flushing the poly(arylene ether) with an inert gas,operating the extruder with the atmospheric vent open, and/or adding upto 20 wt % of polyamide in the first compounding step. The beneficialeffect of compounding under an inert atmosphere is clearly seen inExamples 1-3 where the number of pits per plaque was reduced from 20 inthe control to 2.3 in Example 3. The number of insolubles showed asimilar drop from 3294 in the control to 637 in Example 3. A comparisonof Examples 4 and 5 clearly shows the benefit of flushing thepoly(arylene ether) resin with nitrogen. Examples 4 and 5 are bothcompounded under an inert atmosphere but in Example 5 the poly(aryleneether) resin is flushed with nitrogen. The number of pits per plaque wasfurther reduced by 1 in Example 5 when compared to Example 4 and thenumber of insolubles is reduced from 1151 in Example 4 to 500 in Example5. The advantage of operating with the atmospheric vent is clearly seenin Example 11. Examples 6 through 9 demonstrate the utility of adding aportion of the polyamide at the main feeder as evidenced by a dramaticdrop in the number of pits per plaque from the Control (20) to Example 8(4.2). A similar trend is seen in the insolubles data. Thus, it isclear, especially to one skilled in the art, that each improvement tothe process results in a decrease in the number of pits/insolubles andthe combination of improvements results in a greater decrease inpits/insolubles.

Additionally, the improvements to the injection molding process may beused in combination with improvements to the process of makingpoly(arylene ether)-polyamide compositions or separately. The amount ofcarbonized particles formed during injection molding of poly(aryleneether)-polyamide polymer compositions was distinctly reduced when thefeed hopper was flushed with an inert gas or mixture of gases and aslight over pressure of inert gas was maintained.

As a result of the process of the present invention, poly(aryleneether)-polyamide compositions can be produced having a significantlyreduced number of carbon particles and/or insolubles. Namely, comparedto a composition prepared without employing an inert atmospherepolyamide split-feeding, or air free resins, the poly(aryleneether)-polyamide composition comprises an about 50% or greater reductionof carbon particles, with about 75% or greater reduction preferred,about 85% or greater more preferred and about 90% or greater reductionespecially preferred. Additionally, an about 50% or greater reduction ininsolubles has been achieved with an about 70% or greater reductionpreferred, about 80% or greater reduction more preferred, and an about85% or greater reduction especially preferred.

While preferred embodiments have been shown and described, variousmodifications and substitutions may be made thereto without departingfrom the spirit and scope of the invention. Accordingly, it is to beunderstood that the present invention has been described by way ofillustration and not limitations.

What is claimed is:
 1. A process to produce a poly(aryleneether)-polyamide composition, comprising: creating and maintaining asubstantially inert atmosphere in an extruder; introducing poly(aryleneether) resin to said extruder; compounding said poly(arylene ether); andadding polyamide to said compounded poly(arylene ether) and furthercompounding to form the poly(arylene ether)-polyamide composition. 2.The process to produce a poly(arylene ether)-polyamide composition ofclaim 1, wherein the poly(arylene ether)-polyamide composition comprisesthe reaction product of about 10 wt % to about 90 wt % poly(aryleneether) resin, about 90 wt % to about 10 wt % polyamide resin.
 3. Theprocess to produce a poly(arylene ether)-polyamide composition of claim2, wherein the poly(arylene ether)-polyamide composition comprises about30 wt % to about 60 wt % poly(arylene ether) resin, and about 60 wt % toabout 30 wt % polyamide resin.
 4. The process to produce a poly(aryleneether)-polyamide composition of claim 1, further comprising flushing thepoly(arylene ether) resin with an inert gas.
 5. The process to produce apoly(arylene ether)-polyamide composition of claim 4, wherein the inertgas is selected from the group consisting of nitrogen, hydrogen, helium,neon, argon, carbon dioxide, and mixtures comprising at least one of theforegoing gases.
 6. The process to produce a poly(aryleneether)-polyamide composition of claim 1, wherein the poly(aryleneether)-polyamide composition further comprises impact modifiers, releaseagents, stabilizers, organic fillers, inorganic fillers, conductiveagents, UV stabilizers, anti-oxidants, flame retardants, dripretardants, dyes, pigments, colorants, stabilizers, small particleminerals, antistatic agents, plasticizers, lubricants, or mixturescomprising at least one of the foregoing additives.
 7. The process toproduce a poly(arylene ether)-polyamide composition of claim 1, whereinsaid inert atmosphere is selected from the group consisting of nitrogen,helium, hydrogen, neon, argon, carbon dioxide and mixtures comprising atleast one of the foregoing gases.
 8. The process to produce apoly(arylene ether)-polyamide composition of claim 1, further comprisingadding about up to about 20 wt % of polyamide resin to said extruderwith said poly(arylene ether) resin.
 9. The process to produce apoly(arylene ether)-polyamide composition of claim 1, wherein saidpoly(arylene ether) is selected from the group consisting ofpoly(arylene ether) and copolymers, graft copolymers, and ionomersthereof; block copolymers of alkenyl aromatic compounds, vinyl aromaticcompounds and poly(arylene ether); and combinations comprising at leastone of the foregoing polymers.
 10. The process to produce a poly(aryleneether)-polyamide composition of claim 1, wherein said polyamide isselected from the group consisting of nylon-6, nylon-6,6, nylon-4,nylon-4,6, nylon-12, nylon-6,10, nylon 6,9, amorphous nylon, super toughnylons and combinations comprising at least one of the foregoingpolyamides.
 11. The process to produce a poly(arylene ether)-polyamidecomposition of claim 1, wherein said poly(arylene ether) resin isrepresented by the formula:

wherein each Q is a monovalent substituent individually selected fromhydrogen, halogen, aliphatic and aromatic hydrocarbon and hydrocarbonoxyradicals free of a tertiary alpha-carbon atom and halohydrocarbon andhalohydrocarbonoxy radicals free of a tertiary alpha-carbon atom andhaving at least two carbon atoms between the halogen atom and the phenylnucleus, and wherein at least one Q is hydrogen.
 12. The process toproduce a poly(arylene ether)-polyamide composition of claim 1 furthercomprising adding a compatibility modifier with said poly(arylene ether)to form a mixture wherein said compatibility modifier is selected fromthe group consisting of polycarboxylic acids and their salts,polycarboxylic acid esters, polycarboxylic acid amides, quinones, liquiddiene polymers, epoxy compounds, oxidized polyolefin wax, organosilanecompounds, and combinations comprising at least one of the foregoingcompatibility modifiers.
 13. The process to produce a poly(aryleneether)-polyamide composition of claim 12, further comprising addingabout up to about 20 wt % of polyamide resin to said mixture.
 14. Theprocess to produce a poly(arylene ether)-polyamide composition of claim13, further comprising flushing the mixture with an inert gas.
 15. Theprocess to produce a poly(arylene ether)-polyamide composition of claim14, wherein the inert gas is selected from the group consisting ofnitrogen, hydrogen, helium, neon, argon, carbon dioxide, and mixturescomprising at least one of the foregoing gases.
 16. The process toproduce a poly(arylene ether)-polyamide composition of claim 14, whereinsaid mixture further comprises impact modifiers, release agents,stabilizers, organic fillers, inorganic fillers, conductive agents, UVstabilizers, anti-oxidants, flame retardants, drip retardants, dyes,pigments, colorants, stabilizers, small particle minerals, antistaticagents, plasticizers, lubricants, or mixtures comprising at least one ofthe foregoing additives.
 17. The process to produce a poly(aryleneether)-polyamide composition of claim 13, using an atmospheric vent tovent said mixture.
 18. The process to produce a poly(aryleneether)-polyamide composition of claim 1, using an atmospheric vent tovent said mixture.
 19. The process to produce a poly(aryleneether)-polyamide composition of claim 1, further comprisingpelletization.
 20. The process to produce a poly(aryleneether)-polyamide composition of claim 19, further comprising underwaterpelletization.
 21. A process for producing a poly(aryleneether)-polyamide composition, comprising: combining poly(arylene ether)resin and up to about 20 wt % polyamide resin in said extruder to form amixture; flushing said mixture with an inert gas; compounding saidmixture; and adding additional polyamide resin to said compoundedmixture and further compounding to form the poly(aryleneether)-polyamide composition.
 22. The process to produce a poly(aryleneether)-polyamide composition of claim 21 further comprising adding acompatibility modifier to said mixture wherein said compatibilitymodifier is selected from the group consisting of polycarboxylic acidsand their salts, polycarboxylic acid esters, polycarboxylic acid amides,quinones, liquid diene polymers, epoxy compounds, oxidized polyolefinwax, organosilane compounds and combinations comprising at least one ofthe foregoing compatibility modifiers.
 23. The process to produce apoly(arylene ether)-polyamide composition of claim 22, wherein the inertgas is selected from the group consisting of nitrogen, hydrogen, helium,neon, argon, carbon dioxide, and mixtures comprising at least one of theforegoing inert gases.
 24. The process to produce a poly(aryleneether)-polyamide composition of claim 21, wherein said mixture furthercomprises impact modifiers, release agents, stabilizers, organicfillers, inorganic fillers, conductive agents, UV stabilizers,anti-oxidants, flame retardants, drip retardants, dyes, pigments,colorants, stabilizers, small particle minerals, antistatic agents,plasticizers, lubricants, or mixtures comprising at least one of theforegoing additives.
 25. The process to produce a poly(aryleneether)-polyamide composition of claim 24, using an atmospheric vent tovent said mixture said extruder further comprising an extruder with anatmospheric vent, wherein the vent is disposed between the poly(aryleneether) introduction point and the introduction point of the polyamideand operating with said vent open.
 26. The process to produce apoly(arylene ether)-polyamide composition of claim 21, wherein thepoly(arylene ether)-polyamide composition comprises about 10 wt % toabout 90 wt % poly(arylene ether) resin and about 90 wt % to about 10 wt% polyamide resin.
 27. The process to produce a poly(aryleneether)-polyamide composition of claim 26, wherein the poly(aryleneether)-polyamide composition comprises about 30 wt % to about 60 wt %poly(arylene ether) resin and about 60 wt % to about 30 wt % polyamideresin.
 28. The process to produce a poly(arylene ether)-polyamidecomposition of claim 21, further comprising flushing the poly(aryleneether) resin with an inert gas.
 29. The process to produce apoly(arylene ether)-polyamide composition of claim 28, wherein saidinert atmosphere is selected from the group consisting of nitrogen,helium, hydrogen, neon, argon, carbon dioxide and mixtures comprising atleast one of the foregoing inert gases.
 30. A process for producing apoly(arylene ether)-polyamide composition, comprising: combiningpoly(arylene ether) resin and about 5 wt % to about 10 wt % polyamideresin in said extruder to form a mixture; compounding said mixture; andadding additional polyamide resin to said compounded mixture and furthercompounding to form the poly(arylene ether)-polyamide composition.
 31. Aprocess for producing a poly(arylene ether)-polyamide composition,comprising: combining poly(arylene ether) resin and up to about 15 wt %polyamide resin in said extruder to form a mixture; compounding saidmixture; and adding additional polyamide resin to said compoundedmixture and further compounding to form the poly(aryleneether)-polyamide composition.
 32. The process to produce a poly(aryleneether)-polyamide composition of claim 8, further comprising adding up toabout 15 wt % of said polyamide resin to said mixture.
 33. The processto produce a poly(arylene ether)-polyamide composition of claim 32,further comprising adding about 5 wt % to about 10 wt % of saidpolyamide resin to said mixture.
 34. The process to produce apoly(arylene ether)-polyamide composition of claim 22, furthercomprising combining up to about 15 wt % of said polyamide resin withsaid poly(arylene ether) resin to form said mixture.
 35. The process toproduce a poly(arylene ether)-polyamide composition of claim 34, furthercomprising combining about 5 wt % to about 10 wt % of said polyamideresin with said poly(arylene ether) resin to form said mixture.